HTxxx/HTMxxx/STxxx Switching Thyristors - Teccor® Standard Bidirectional DIAC Trigger

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Littelfuse Teccor® DIAC Thyristor Data Sheet
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Last Uploaded: October 02, 2008

Teccor® Standard Bidirectional DIAC Trigger

Littelfuse's Teccor brand "HT" and "ST" Series of bilateral trigger diacs are available with switching voltages from 27V to 70V.

A diac is a full-wave or bidirectional thyristor. Whenever the amplitude of applied voltage exceeds the breakover voltage rating of the diac, it switches from blocking- to conducting-state.

Teccor diacs feature glass-passivated junctions that ensure long term reliability and stable characteristics by creating a rugged, reliable barrier against junction contamination.

These diac specifications are for standard products. Special parameter selections such as close tolerance voltage symmetry are available. Please consult the factory for more information for custom design applications.

Notes

Breakover voltage symmetry as close as 1 V is available from the factory on these products.
Lead solder temperature is +230 �C for 10-second maximum; >=1/16" (1.59 mm) from case.

Electrical Characteristics

Access specifications, certifications, check availability and order parts below:

Check distributor stock availability by clicking on the [CHECK] link. View certification PDF files by clicking on the certification logo. View the part details by clicking on the part number. To order sample parts, click on the [ADD] link. Click on the 'Key' button to view definitions for each column header. Sort parts by clicking on the column you wish to sort by.

CatalogNo	Size	V_BOMAX (V)	V_BOMIN (V)	Stock	Sample Cart
HT32 Obsolete: 2009-12-31	DO-35	37	27	[Check]	n/a
HT32A Obsolete: 2009-12-31	DO-35	36	28	[Check]	n/a
HT32B Obsolete: 2009-12-31	DO-35	34	30	[Check]	n/a
HT34B Obsolete: 2009-12-31	DO-35	36	32	[Check]	n/a
HT35 Obsolete: 2009-12-31	DO-35	40	30	[Check]	n/a
HT36A Obsolete: 2009-12-31	DO-35	40	32	[Check]	n/a
HT36B Obsolete: 2009-12-31	DO-35	38	34	[Check]	n/a
HT40 Obsolete: 2009-12-31	DO-35	45	35	[Check]	n/a
HT5761 Obsolete: 2008-12-31 Replaced By HT32A	DO-35	36	28	[Check]	n/a
HT5761A Obsolete: 2008-12-31 Replaced By HT32B	DO-35	34	30	[Check]	n/a
HT5762 Obsolete: 2008-12-31 Replaced By HT36A	DO-35	40	32	[Check]	n/a
HT60 Obsolete: 2009-12-31	DO-35	70	56	[Check]	n/a
HTM32 Obsolete: 2009-12-31	MINIMELF	27	37	[Check]	n/a
HTM32B Obsolete: 2009-12-31	MINIMELF	30	34	[Check]	n/a
HTM34B Obsolete: 2009-12-31	MINIMELF	32	36	[Check]	n/a
HTM35 Obsolete: 2009-12-31	MINIMELF	30	40	[Check]	n/a
HTM36B Obsolete: 2009-12-31	MINIMELF	34	38	[Check]	n/a
HTM40 Obsolete: 2009-12-31	MINIMELF	35	45	[Check]	n/a
ST32 Obsolete: 2009-12-31	DO-214	37	27	[Check]	n/a
ST32B Obsolete: 2009-12-31	DO-214	34	30	[Check]	n/a
ST34B Obsolete: 2009-12-31	DO-214	36	32	[Check]	n/a
ST35 Obsolete: 2009-12-31	DO-214	40	30	[Check]	n/a
ST36A Obsolete: 2009-12-31	DO-214	40	32	[Check]	n/a
ST36B Obsolete: 2009-12-31	DO-214	38	34	[Check]	n/a
ST40 Obsolete: 2009-12-31	DO-214	45	35	[Check]	n/a

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Technical Resources

Application Notes

Product Catalogs

Application Circuits

	AN1001 - Fundamental Characteristics of Thyristors The thyristor family of semiconductors consists of several very useful devices. The most widely used of this family are silicon controlled rectifiers (SCRs), triacs, sidacs, and diacs. In many applications these devices perform key functions and are real assets in meeting environmental, speed, and reliability specifications which their electro-mechanical counterparts cannot fulfill. This application note presents the basic fundamentals of SCR, triac, sidac, and diac thyristors so the user understands how they differ in characteristics and parameters from their electromechanical counterparts. Also, thyristor terminology is defined. AN1001.pdf (122 K)
	AN1004 - Mounting and Handling of Semiconductor Devices Proper mounting and handling of semiconductor devices, particularly those used in power applications, is an important, yet sometimes overlooked, consideration in the assembly of electronic systems. Power devices need adequate heat dissipation to increase operating life and reliability and allow the device to operate within manufacturers' specifications. Also, in order to avoid damage to the semiconductor chip or internal assembly, the devices should not be abused during assembly. Very often, device failures can be attributed directly to a heat sinking or assembly damage problem. The information in this application note guides the semiconductor user in the proper use of Teccor devices, particularly the popular and versatile TO-220 and TO-202 epoxy packages. AN1004.pdf (149 K)
	AN1005 - Teccor® Thyristor Surface Mount Soldering Recommendations The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability. This application note discusses the different soldering methods for Littelfuse's Teccor brand thyristor products. AN1005.pdf (169 K)
	AN1006 - Testing Teccor® Semiconductor Devices Using Curve Tracers One of the most useful and versatile instruments for testing semiconductor devices is the curve tracer (CT). Although widely used by semiconductor manufacturers for design and analytical work, the device consumer will find many uses for the curve tracer, such as incoming quality control, failure analysis, and supplier comparison. Curve tracers may be easily adapted for go-no go production testing. This application note describes how to use curve tracers. AN1006.pdf (310 K)
	AN1008 - Explanation of Maximum Ratings and Characteristics for Thyristors Data sheets for SCRs and triacs give vital information regarding maximum ratings and characteristics of thyristors. If the maximum ratings of the thyristors are surpassed, possible irreversible damage may occur. This application note explains those ratings and describe various pertinent device parameters which are guaranteed as either minimums or maximums. AN1008.pdf (123 K)
	AN1009 - Teccor® Thyristors - Miscellaneous Design Tips and Facts This application note presents design tips and facts on the following topics: -Relationship of IAV, IRMS, and IPK -dv/dt Definitions -Examples of gate terminations -Curves for Average Current at Various Conduction Angles -Double-exponential Impulse Waveform -Failure Modes of Thyristor -Characteristics Formulas for Phase Control AN1009.pdf (108 K)

•	Ballast : High Frequency Inverter Diac
•	Electronic Ballast : High Frequency Inverter Diac
•	Linear Phase Control Dimmer : Regulator Diac
•	Linear Phase Control Dimmer : Trigger Diac

	Power Thyristor Databook - Package Dimensions Summary of all available package sizes and their corresponding dimensions. Littelfuse_Thyristor_Package_Dimensions.pdf (127 K)
	Power Thyristor Databook - Packaging Options Detailed description of all power thyristor packaing options, includes: -Bulk Pack -Reel Pack (RP) -Ammo Pack (AP) -Tube Pack (TP) -Embossed Carrier (RP) M3PackingOptions.pdf (300 K)
	Power Thyristor Databook - Lead Form Options M2LeadFormDim.pdf (145 K)