Part Number: P1500Q22CLRP
Series: Q2L (C Rated)

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Q2L (C Rated) Series - QFN SIDACtor® Device

The Q2L SIDACtor series provides bidirectional transient voltage protection in a low profile, chip scale package. The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment.

Features:
  • RoHS compliant
  • Chip Scale Package (CSP) sizing
  • Wide range of IPP ratings including:
  • --500A for 2x10μs GR 1089 waveform
  • --200A for 5x310/10x700µs ITU/YDT waveform
  • --100A for 10x1000µs GR 1089 waveform
  • --150A for 10x560µs TIA-968
  • Bidirectional transient voltage protection
  • Small footprint (QFN)
  • Teccor® brand SIDACtor technology
  • Recognized under UL E133083 file number
Protection solution to meet:
  • YD/T 950
  • YD/T 993
  • YD/T 1082
  • GR 1089
  • IEC 61000-4-5
  • ITU K.20/21
  • TIA-968-A

Electrical Characteristics

Help Property Value
Ipp2x10 500
Ipp5x310 200
Ipp10x700 200
Ipp10x560 150
Ipp10x160 200
Ipp8x20 400
Ipp10x1000 100
Regulatory Requirements YD/T 993-1998 With Primary
Regulatory Requirements YD/T 993-1998 Without Primary
Regulatory Requirements TIA-968-A
Regulatory Requirements ITU K.21 Enhanced
Regulatory Requirements ITU K.20 Enhanced
Regulatory Requirements ITU K.20
Regulatory Requirements GR1089 Inter Building
Regulatory Requirements GR1089 Intra-Building
Ipp5x320 200
di/dt @ 110°C (A/μs) 500
Pins Tip to Ring 1-2
Max Capacitance Tip to Ring (pF) 55
Min Capacitance Tip to Ring (pF) 35
IDRM @ VDRM (μA) 5
Iscurr 800
Holding Current (mA) 150
Package Size QFN
Switching Voltage Tip to Ring (V) 180
Peak Off-State Voltage Tip to Ring (V) 140