Part Number: P0641Q22CLRP
Series: Q2L C-Rated SLIC

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Q2L C-Rated SLIC Series - QFN SIDACtor® Device

The Q2L SIDACtor SLIC series provides unidirectional transient voltage protection in a low profile, Chip Scale Package (CSP). The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications that have multiple lines per card. The high density SLIC cards will benefit from this CSP technology by being able to “fit more” protection in a smaller PCB area.

Features

  • RoHS compliant
  • Chip Scale Package (CSP) sizing
  • Wide range of IPP ratings including:
    • 500A for 2x10μs GR 1089 waveform
    • 200A for 5x310/10x700μs ITU/YDT waveform
    • 100A for 10x1000μs GR 1089 waveform
    • 150A for 10x560µμs TIA-968-A
  • Unidirectional transient voltage protection
  • Small footprint (QFN)
  • Teccor brand SIDACtor technology
Protection solution to meet
  • YD/T 950
  • YD/T 993
  • YD/T 1082
  • GR 1089
  • IEC 61000-4-5
  • ITU K.20/21 Basic/Enhanced
  • TIA-968-A

Electrical Characteristics

Help Property Value
Ipp2x10 500
Ipp5x310 200
Ipp10x700 200
Ipp10x560 150
Ipp10x160 200
Ipp8x20 400
Ipp10x1000 100
Regulatory Requirements YD/T 993-1998 With Primary
Regulatory Requirements YD/T 993-1998 Without Primary
Regulatory Requirements TIA-968-A
Regulatory Requirements ITU K.21 Enhanced
Regulatory Requirements ITU K.20 Enhanced
Regulatory Requirements ITU K.20
Regulatory Requirements GR1089 Inter Building
Regulatory Requirements GR1089 Intra-Building
Ipp5x320 200
di/dt @ 110°C (A/μs) 500
Pins Tip to Ring 1-2
Max Capacitance Tip to Ring (pF) 120
Min Capacitance Tip to Ring (pF) 65
IDRM @ VDRM (μA) 5
Iscurr 800
Vf 5
Holding Current (mA) 120
Package Size QFN
Switching Voltage Tip to Ring (V) 77
Peak Off-State Voltage Tip to Ring (V) 58