Sensitive Triacs Switching Thyristors - Teccor® Sensitive Triac Devices

Download Datasheet

Teccor® Sensitive Triac Data Sheet
E1SensitiveTriac.pdf
(172,762 bytes)
Last Uploaded: February 23, 2005

Teccor® Sensitive Triac Devices

Teccor brand line of sensitive gate triacs includes devices with current capabilities through 8A. Voltage ranges are available from 200V to 600V. This line features devices with guaranteed gate control in Quadrants II and IV as well as control in the commonly used Quadrants I and III. Four-quadrant control devices require sensitive gate triacs. They can be controlled by digital circuitry where positive-only or negative-only pulses must control AC current in both directions through the device. Note that triacs with low IGT values in Quadrants II and IV will have lower dv/dt characteristics.

The sensitive gate triac is a bidirectional AC switch and is gate controlled for either polarity of main terminal voltage. It is used primarily for AC switching and phase control applications such as motor speed controls, temperature modulation controls, and lighting controls.

The epoxy TO-92 and TO-220 configurations feature Littelfuse's electrically-isolated construction where the case or mounting tab is internally isolated from the semiconductor chip and lead attachments. Non-isolated epoxy TO-202 packages are available as well as TO-251 and surface mount TO-252 (D-Pak). Tapeand-reel capability and tube packing also are available.

All Teccor triacs have glass-passivated junctions. This glassing process prevents migration of contaminants and ensures longterm device reliability with parameter stability.

Variations of devices covered in this data sheet are available for custom design applications. Consult factory for more information.

Notes:

All measurements are made at 60�Hz with a resistive load at an ambient temperature of +25�C unless otherwise specified.
Operating temperature range (Tj) is -65�C to +110�C for TO-92 devices and -40�C to +110�C for all other devices.
Storage temperature range (Ts) is -65�C to +150�C for TO-92 devices, -40�C to +150�C for TO-202 devices, and -40�C to +125�C for TO-220 devices.
Lead solder temperature is a maximum of 230�C for 10 s maximum at a minimum of 1/16"(1.59 mm) from case.
The case or lead temperature (Tc or Tl) is measured as shown on dimensional outline drawings. See Package Dimensions.

Electrical Characteristics

Access specifications, certifications, check availability and order parts below:

Check distributor stock availability by clicking on the [CHECK] link. View certification PDF files by clicking on the certification logo. View the part details by clicking on the part number. To order sample parts, click on the [ADD] link. Click on the 'Key' button to view definitions for each column header. Sort parts by clicking on the column you wish to sort by.

CatalogNo	Size	I_TRMS (A)	V_DRM (V)	I_DRM@ V_DRM 25°C (mA)	I_DRM@ V_DRM 110°C (mA)	I_GTQ1 MAX (mA)	I_GTQ2 MAX (mA)	I_GTQ3 MAX (mA)	I_GTQ4 MAX (mA)	V_TM (V)	I_TSM 60Hz (A)	di/dt @ 110°C (A/μs)	Stock	Sample Cart
L2004F31	TO-202	4	200	0.01	0.2	3	3	3	3	1.6	40	50	[Check]	[Add]
L2004F51	TO-202	4	200	0.01	0.2	5	5	5	5	1.6	40	50	[Check]	[Add]
L2004F61	TO-202	4	200	0.01	0.2	5	5	5	10	1.6	40	50	[Check]	[Add]
L2004F81	TO-202	4	200	0.01	0.2	10	10	10	20	1.6	40	50	[Check]	[Add]
L4004F31	TO-202	4	400	0.01	0.2	3	3	3	3	1.6	40	50	[Check]	[Add]
L4004F51	TO-202	4	400	0.01	0.2	5	5	5	5	1.6	40	50	[Check]	[Add]
L4004F61	TO-202	4	400	0.01	0.2	5	5	5	10	1.6	40	50	[Check]	[Add]
L4004F81	TO-202	4	400	0.01	0.2	10	10	10	20	1.6	40	50	[Check]	[Add]
L6004F31	TO-202	4	600	0.01	0.2	3	3	3	3	1.6	40	50	[Check]	[Add]
L6004F51	TO-202	4	600	0.01	0.2	5	5	5	5	1.6	40	50	[Check]	[Add]
L6004F61	TO-202	4	600	0.01	0.2	5	5	5	10	1.6	40	50	[Check]	[Add]
L6004F81	TO-202	4	600	0.01	0.2	10	10	10	20	1.6	40	50	[Check]	[Add]

Find A Distributor

Technical Resources

Application Notes

Plant Certifications

Wuxi ISO-TS16949-2002 Certification
Littelfuse_Wuxi_ISO-TS16949-2002.pdf (179 K)

Product Catalogs

Application Circuits

• Printer : Fuser lamp

Environmental Data

Environmental Info

RoHS Date: See Notes

Part# Identifier: Std p/n

Notes
DO-214: Compliant as of 9/1/2004 TO-200L: Compliant as of 1996 TO-251 VPAK: Compliant as of 9/1/2004 TO-252 DPAK: Compliant as of 9/1/2004 TO-202: Compliant as of 1996 To-92 (TdM Build): Compliant as of 11-1-04
ICP Test Reports
RoHS Compliance TO-202 2006-10-15.pdf
China RoHS Reports
ChinaRoHS Thyristor SIDAC TO-202.pdf

	AN1001 - Fundamental Characteristics of Thyristors The thyristor family of semiconductors consists of several very useful devices. The most widely used of this family are silicon controlled rectifiers (SCRs), triacs, sidacs, and diacs. In many applications these devices perform key functions and are real assets in meeting environmental, speed, and reliability specifications which their electro-mechanical counterparts cannot fulfill. This application note presents the basic fundamentals of SCR, triac, sidac, and diac thyristors so the user understands how they differ in characteristics and parameters from their electromechanical counterparts. Also, thyristor terminology is defined. AN1001.pdf (122 K)
	AN1002 - Gating, Latching, and Holding of SCRs and Triacs Gating, latching, and holding currents of thyristors are some of the most important parameters. These parameters and their interrelationship determine whether the SCRs and triacs will function properly in various circuit applications. This application note describes how the SCR and triac parameters are related. This knowledge helps users select best operating modes for various circuit applications. AN1002.pdf (104 K)
	AN1003 - Phase Control Using Teccor® Thyristors Due to high-volume production techniques, thyristors are now priced so that almost any electrical product can benefit from electronic control. A look at the fundamentals of SCR and triac phase controls shows how this is possible. AN1003.pdf (168 K)
	AN1004 - Mounting and Handling of Semiconductor Devices Proper mounting and handling of semiconductor devices, particularly those used in power applications, is an important, yet sometimes overlooked, consideration in the assembly of electronic systems. Power devices need adequate heat dissipation to increase operating life and reliability and allow the device to operate within manufacturers' specifications. Also, in order to avoid damage to the semiconductor chip or internal assembly, the devices should not be abused during assembly. Very often, device failures can be attributed directly to a heat sinking or assembly damage problem. The information in this application note guides the semiconductor user in the proper use of Teccor devices, particularly the popular and versatile TO-220 and TO-202 epoxy packages. AN1004.pdf (149 K)
	AN1005 - Teccor® Thyristor Surface Mount Soldering Recommendations The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability. This application note discusses the different soldering methods for Littelfuse's Teccor brand thyristor products. AN1005.pdf (169 K)
	AN1006 - Testing Teccor® Semiconductor Devices Using Curve Tracers One of the most useful and versatile instruments for testing semiconductor devices is the curve tracer (CT). Although widely used by semiconductor manufacturers for design and analytical work, the device consumer will find many uses for the curve tracer, such as incoming quality control, failure analysis, and supplier comparison. Curve tracers may be easily adapted for go-no go production testing. This application note describes how to use curve tracers. AN1006.pdf (310 K)
	AN1008 - Explanation of Maximum Ratings and Characteristics for Thyristors Data sheets for SCRs and triacs give vital information regarding maximum ratings and characteristics of thyristors. If the maximum ratings of the thyristors are surpassed, possible irreversible damage may occur. This application note explains those ratings and describe various pertinent device parameters which are guaranteed as either minimums or maximums. AN1008.pdf (123 K)
	AN1009 - Teccor® Thyristors - Miscellaneous Design Tips and Facts This application note presents design tips and facts on the following topics: -Relationship of IAV, IRMS, and IPK -dv/dt Definitions -Examples of gate terminations -Curves for Average Current at Various Conduction Angles -Double-exponential Impulse Waveform -Failure Modes of Thyristor -Characteristics Formulas for Phase Control AN1009.pdf (108 K)

	Power Thyristor Databook - Package Dimensions Summary of all available package sizes and their corresponding dimensions. Littelfuse_Thyristor_Package_Dimensions.pdf (127 K)
	Power Thyristor Databook - Lead Form Options M2LeadFormDim.pdf (145 K)
	Power Thyristor Databook - Packaging Options Detailed description of all power thyristor packaing options, includes: -Bulk Pack -Reel Pack (RP) -Ammo Pack (AP) -Tube Pack (TP) -Embossed Carrier (RP) M3PackingOptions.pdf (300 K)