Q2L (C Rated) Series - QFN SIDACtor® Device

Littelfuse_SIDACtor_Q2L_C
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The Q2L SIDACtor® series provides bidirectional transient voltage protection in a low profile, chip scale package. The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment.

Features:
  • RoHS compliant
  • Chip Scale Package (CSP) sizing
  • Wide range of IPP ratings including:
  • --500A for 2x10μs GR 1089 waveform
  • --200A for 5x310/10x700µs ITU/YDT waveform
  • --100A for 10x1000µs GR 1089 waveform
  • --150A for 10x560µs TIA-968
  • Bidirectional transient voltage protection
  • Small footprint (QFN)
  • Teccor® brand SIDACtor technology
  • Recognized under UL E133083 file number
Protection solution to meet:
  • YD/T 950
  • YD/T 993
  • YD/T 1082
  • GR 1089
  • IEC 61000-4-5
  • ITU K.20/21
  • TIA-968-A

Access specifications, certifications, check availability and order parts below

Catalog #VDRM T-R
(V)
VS T-R
(V)
SizePins T-RCO 2V
T-R MAX
(pF)
CO 2V
T-R MIN
(pF)
IscurrIDRM @
VDRM
(μA)
IH (mA)di/dt @
110°C
(A/μs)
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