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Series: Q2L C-Rated SLIC

QFN SIDACtor® Device
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The Q2L SIDACtor® SLIC series provides unidirectional transient voltage protection in a low profile, Chip Scale Package (CSP). The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications that have multiple lines per card. The high density SLIC cards will benefit from this CSP technology by being able to fit more protection in a smaller PCB area.

Protection solution to meet:
  • YD/T 950
  • YD/T 993
  • YD/T 1082
  • GR 1089
  • IEC 61000-4-5
  • ITU K.20/21 Basic/Enhanced
  • TIA-968-A
  • RoHS compliant
  • Chip Scale Package (CSP) sizing
  • Wide range of IPP ratings including:
  • 500A for 2x10μs GR 1089 waveform
  • 200A for 5x310/10x700μs ITU/YDT waveform
  • 100A for 10x1000μs GR 1089 waveform
  • 150A for 10x560µÎ¼s TIA-968-A
  • Unidirectional transient voltage protection
  • Small footprint (QFN)
  • Teccor® brand SIDACtor® technology

Q2L C-Rated SLIC Parts

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Series: Q2L C-Rated SLIC Resources