D8025L - Dxx15L/Dxx20L/Dxx25L Series

Series: Dxx15L/Dxx20L/Dxx25L      Obsolete: 2016-03-31      Replaced By: D8025LTP Questions? Contact Littelfuse Support
Littelfuse manufactures 15A rms to 25A rms rectifiers with voltages rated from 200V to 1000V. Due to the electrically-isolated TO-220 package, these rectifiers may be used in common anode or common cathode circuits using only one part type, thereby simplifying stock requirements.

Teccor brand silicon rectifiers feature glass-passivated junctions to ensure long term reliability and stability. In addition, glass offers a rugged, reliable barrier against junction contamination.

Notes:
  • Operating temperature range (Tj) is -40°C to +125°C.
  • Storage temperature range (TS) is -40°C to +125°C.
  • Lead solder temperature is a maximum of 230°C for 10 seconds maximum at a minimum of 1/16" (1.59 mm) from case.
  • The case temperature (Tc) is measured as shown on dimensional outline drawings. See Package Dimensions.
  • Teccor's electrically-isolated TO-220 devices withstand a high potential test of 2500VacIrms from leads to mounting tab over the operating temperature range.
  • Typical Reverse Recovery Time (trr) is 4µs. (Test conditions = 0.9A forward current and 1.5A reverse current.)

UR UR_QQQX2_E71639

Wuxi ISO TS16949 Certification

ChinaRoHS_Thyristor_TO 220L pdf

RoHS_Compliance_TO 220L_2007 06 15 pdf

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Proper mounting and handling of semiconductor devices, particularly those used in power applications, is an important, yet sometimes overlooked, consideration in the assembly of electronic systems. Power devices need adequate heat dissipation to increase operating life and reliability and allow the device to operate within manufacturers' specifications. Also, in order to avoid damage to the semiconductor chip or internal assembly, the devices should not be abused during assembly. Very often, device failures can be attributed directly to a heat sinking or assembly damage problem. The information in this application note guides the semiconductor user in the proper use of Teccor devices, particularly the popular and versatile TO-220 and TO-202 epoxy packages.

pdf icon Surface Mount Soldering Recommendations Application Note

The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability. This application note discusses the different soldering methods for Littelfuse's Teccor brand thyristor products.

AN1006 Testing Teccor Semiconductor Devices Using Curve Tracers

One of the most useful and versatile instruments for testing semiconductor devices is the curve tracer (CT). Although widely used by semiconductor manufacturers for design and analytical work, the device consumer will find many uses for the curve tracer, such as incoming quality control, failure analysis, and supplier comparison. Curve tracers may be easily adapted for go-no go production testing. This application note describes how to use curve tracers.

AN1009 Teccor Thyristors Miscellaneous Design Tips and Facts

This application note presents design tips and facts on the following topics: -Relationship of IAV, IRMS, and IPK -dv/dt Definitions -Examples of gate terminations -Curves for Average Current at Various Conduction Angles -Double-exponential Impulse Waveform -Failure Modes of Thyristor -Characteristics Formulas for Phase Control

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