SLD8S20A - SLD8S Series

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The SLD8S Series is SMTO-263 packaged with leaded modification and is designed to provide precision overvoltage protection for sensitive electronics

Features:
  • AEC-Q101 qualified
  • SMTO-263 package, and foot print is compatible to industrial popular DO-218AB package
  • Meet ISO7637-2 5a/5b protection and ISO16750 load dump test (refer to APP note for details)
  • VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT: Temperature Coefficient, typical value is 0.1%)
  • Glass passivated chip junction in modified TO-263 package
  • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
  • ESD protection of data lines in accordance with IEC 61000-4-2
  • EFT protection of data lines in accordance with IEC 61000-4-4
  • Fast response time: typically less than 1.0ps from 0 Volts to BV min
  • Excellent clamping capability
  • Low incremental surge resistance
  • Plastic package is flammability rated V-0 per Underwriters Laboratories
  • Meet MSL level 1, per J-STD-020, LF maximum peak of 260°C
  • For surface mounted applications to optimize board space 
  • Low profile package
  • High temperature to reflow soldering guaranteed: 260°C/10sec at terminals
  • Typical failure mode is short from over-specified voltage or current
  • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
  • Matte tin lead–free plated
  • Halogen free and RoHS compliant
  • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD- 609A.01)
Applications:

Designed to protect sensitive electronics from:
  • Inductive Load Switching
  • Alternator Load Dump

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    PbFree7/5/2016 RoHS7/5/2016