5.0SMDJ30AS - 5.0SMDJxxS Series

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Disclaimer Notice

Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse.

The 5.0SMDJxxS series, single chip design is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient

voltage events. 

 

Features:

  • Maximum Peak Pulse Power Dissipation is 5000W ( 10/1000μs Waveform)
  • For surface mounted applications to optimize board space
  • Low profile package
  • Excellent clamping capability
  • Very fast response time
  • Typical failure mode is short from over-specified voltage or current
  • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
  • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
  • ESD protection of data lines in accordance with IEC 61000-4-2
  • EFT protection of data lines in accordance with IEC 61000-4-4
  • Built-in strain relief
  • Glass passivated chip junction
  • Low incremental surge resistance
  • Typical IR less than 1μA when VBR  min>12V
  • High temperature to reflow soldering guaranteed: 260°C/10sec • VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
  • Plastic package is flammability rated V-0 per Underwriters Laboratories
  • Meet MSL level1, per J-STD-020, LF maximum peak of 260°C
  • Matte tin lead–free plated
  • Halogen free and RoHS compliant
  • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD-609A.01)

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