FMD47-06KC5 - Multi-Chip Configurations Series

ISOPLUS i4-PAC
Roll Over to Zoom
Disclaimer Notice

Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. "Littelfuse" includes Littelfuse, Inc., and all of its affiliate entities.

These Power MOSFETs based on Super Junction technology feature the lowest RDS(on) in 600V-800V class MOSFETs. Internal DCB isolation simplifies assembly and reduces thermal resistance from junction to heat sink. These devices are Avalanche rated, thereby guaranteeing rugged operation.

Features:

  • Silicon chip on Direct-Copper-Bond substrate
  • Fast CoolMOS™(1) power MOSFET 4th generation
  • Enhanced total power density
  • HiPerDyn™ FRED

Applications:

  • Switch mode power supplies
  • Uninterruptible power supplies
  • Power factor correction (PFC)

Advantages:

  • Easy assembly
  • Space savings
  • High power density
  • High reliability


(1) CoolMOS™ is a trademark of Infineon Technologies AG.