XSF30xxxxAN - Heatsinks Series

Littelfuse Power Semiconductors WH9 Image
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Disclaimer Notice

Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. "Littelfuse" includes Littelfuse, Inc., and all of its affiliate entities.

To enable the correct cooling of the semiconductor device during operation, Littelfuse provides a full range of Aluminium heatsinks. These have been designed to suit both the correct distribution of force during clamping and also air-flows required to cool the devices during operation.

For additional technical details, please contact support.

Property (Mouseover for details) Value
Dimensions 125mm x 125mm x 4 vanes
Package Type WH9
Sample Request No
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