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IXYN110N120C4H1

Product Status| Activei

IXYN110N120C4H1

Disc IGBT XPT Gen4 1200V 110A SOT227B | Series: Trench
info

Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities.

These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse

Advantages:

  • Hard-switching capabilities
  • High power densities
  • Temperature stability of diode forward voltage VF
  • Low gate drive requirements
PropertyValue
VCES (V)
1200
IC @ 25 °C (A)
210
VCE(sat) (V)
2.4
TJ Max (°C)
175
tfi (ns)
90
Configuration
Copack (Sonic-FRD)
Package Type
SOT-227U
Status
Active
Eoff @ 150 °C (mJ)
3.2
IC @ 110 °C (A)
110
RthJC [Diode] (K/W)
0.41
RthJC (K/W)
0.18
Ptot (W)
830
Forward Current @ 110 °C (A)
74
  • Low Vcesat, low Eon/Eoff
  • High surge current capability and short circuit capability
  • Positive thermal coefficient of Vcesat

IXYN110N120C4H1 Applications

Highlights Section

  • Battery Chargers
  • Lamp Ballast
  • Motor Drives
  • Power Inverters
  • Welding Machines

IXYN110N120C4H1 Resources

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IXYN110N120C4H1Disc IGBT XPT Gen4 1200V 110A SOT227B

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