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IXYN140N120A4

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IXYN140N120A4

Disc IGBT XPT Gen4 1200V 140A SOT227 | Series: Trench
info

Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.

Advantages:

  • Ideal for high power density and high inrush currents, low loss applications
  • Hard-switching capable
  • Easy paralleling of devices
  • Reduced gate driver requirements
  • Ease of replacement and availability of isolation package
PropertyValue
VCES (V)
1200
IC @ 25 °C (A)
480
VCE(sat) (V)
1.7
tfi (ns)
320
Configuration
Single
Package Type
SOT-227
Status
Active
RthJC [IGBT] (K/W)
0.14
Eoff @ 150 °C (mJ)
20
IC @ 110 °C (A)
140
  • Low on-state voltages Vcesat
  • Positive thermal coefficient of Vcesat
  • International standard packages

IXYN140N120A4 Applications

Highlights Section

  • Battery chargers
  • Lamp ballasts
  • Power inverters
  • Uninterruptible power supplies (UPS)
  • Welding machines

IXYN140N120A4 Resources

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Part NumberPart DescriptionRoHSPb-FreeRoHS (2015/863/EU) CertificateREACH (SVHC's) DeclarationREACH (SVHC's)Halogen FreeIPC-Material Declaration
IXYN140N120A4Disc IGBT XPT Gen4 1200V 140A SOT227

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