P2600Q22CLRP - Q2L (C Rated) Series

Littelfuse_SIDACtor_Q2L_C
The Q2L SIDACtor® series provides bidirectional transient voltage protection in a low profile, chip scale package. The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment.

Features:
  • RoHS compliant
  • Chip Scale Package (CSP) sizing
  • Wide range of IPP ratings including:
  • --500A for 2x10μs GR 1089 waveform
  • --200A for 5x310/10x700µs ITU/YDT waveform
  • --100A for 10x1000µs GR 1089 waveform
  • --150A for 10x560µs TIA-968
  • Bidirectional transient voltage protection
  • Small footprint (QFN)
  • Teccor® brand SIDACtor technology
  • Recognized under UL E133083 file number
Protection solution to meet:
  • YD/T 950
  • YD/T 993
  • YD/T 1082
  • GR 1089
  • IEC 61000-4-5
  • ITU K.20/21
  • TIA-968-A
Property (Mouseover for details) Value
Max Capacitance Tip to Ring (pF) 45
Min Capacitance Tip to Ring (pF) 30
di/dt @ 110°C (A/μs) 500
IDRM @ VDRM (μA) 5
Holding Current (mA) 150
Iscurr 800
Package Size QFN
Regulatory Requirements GR1089 INTER BUILDING
GR1089 INTRA-BUILDING
ITU K.20
ITU K.20 ENHANCED
ITU K.21 ENHANCED
TIA-968-A
YD/T 993-1998 WITH PRIMARY
YD/T 993-1998 WITHOUT PRIMARY
Ipp10x1000 100
Ipp10x160 200
Ipp10x560 150
Ipp10x700 200
Ipp2x10 500
Ipp5x310 200
Ipp5x320 200
Ipp8x20 400
Peak Off-State Voltage Tip to Ring (V) 220
Pins Tip to Ring 1-2
Switching Voltage Tip to Ring (V) 300

QVGQ2 E133083icon QVGQ2_E133083

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