L2004F81 - Teccor® Sensitive Triac Devices Series

Series: Teccor® Sensitive Triac Devices
Obsolete: 2007 -12-10 Replaced By: L4004L8 L4004V8 Availability: Obsolete


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Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. "Littelfuse" includes Littelfuse, Inc., and all of its affiliate entities.

Teccor brand line of sensitive gate triacs includes devices with current capabilities through 8A. Voltage ranges are available from 200V to 600V. This line features devices with guaranteed gate control in Quadrants II and IV as well as control in the commonly used Quadrants I and III. Four-quadrant control devices require sensitive gate triacs. They can be controlled by digital circuitry where positive-only or negative-only pulses must control AC current in both directions through the device. Note that triacs with low IGT values in Quadrants II and IV will have lower dv/dt characteristics.

The sensitive gate triac is a bidirectional AC switch and is gate controlled for either polarity of main terminal voltage. It is used primarily for AC switching and phase control applications such as motor speed controls, temperature modulation controls, and lighting controls.

The epoxy TO-92 and TO-220 configurations feature Littelfuse's electrically-isolated construction where the case or mounting tab is internally isolated from the semiconductor chip and lead attachments. Non-isolated epoxy TO-202 packages are available as well as TO-251 and surface mount TO-252 (D-Pak). Tapeand-reel capability and tube packing also are available.

All Teccor triacs have glass-passivated junctions. This glassing process prevents migration of contaminants and ensures longterm device reliability with parameter stability.

Variations of devices covered in this data sheet are available for custom design applications. Consult factory for more information.

  • All measurements are made at 60 Hz with a resistive load at an ambient temperature of +25°C unless otherwise specified.
  • Operating temperature range (Tj) is -65°C to +110°C for TO-92 devices and -40°C to +110°C for all other devices.
  • Storage temperature range (Ts) is -65°C to +150°C for TO-92 devices, -40°C to +150°C for TO-202 devices, and -40°C to +125°C for TO-220 devices.
  • Lead solder temperature is a maximum of 230°C for 10 s maximum at a minimum of 1/16"(1.59 mm) from case.
  • The case or lead temperature (Tc or Tl) is measured as shown on dimensional outline drawings. See Package Dimensions.

pdficon Gating Latching and Holding of SCRs and Triacs Application Note

Gating latching and holding currents of thyristors are some of the most important parameters. These parameters and their interrelationship determine whether the SCRs and triacs will function properly in various circuit applications.This application note describes how the SCR and triac parameters are related. This knowledge helps users select best operating modes for various circuit applications.

pdficon Thyristor Fundamental Characteristics of Thyristors Application Note

The thyristor family of semiconductors consists of several very useful devices. The most widely used of this family are silicon controlled rectifiers (SCRs) triacs sidacs and diacs. In many applications these devices perform key functions and are real assets in meeting environmental speed and reliability specifications which their electro-mechanical counterparts cannot fulfill. This application note presents the basic fundamentals of SCR triac sidac and diac thyristors so the user understands how they differ in characteristics and parameters from their electromechanical counterparts. Also thyristor terminology is defined.

pdficon Circuit Protection Technology Application Matrix

Littelfuse is the world leader in the design and manufacturing of fuses for the automotive industrial handheld computer and telecom markets...

pdficon Teccor Sensitive Triac Data Sheet

pdficon Mounting and Handling of Semiconductor Devices Application Note

Proper mounting and handling of semiconductor devices particularly those used in power applications is an important yet sometimes overlooked consideration in the assembly of electronic systems. Power devices need adequate heat dissipation to increase operating life and reliability and allow the device to operate within manufacturers' specifications. Also in order to avoid damage to the semiconductor chip or internal assembly the devices should not be abused during assembly. Very often device failures can be attributed directly to a heat sinking or assembly damage problem. The information in this application note guides the semiconductor user in the proper use of Teccor devices particularly the popular and versatile TO-220 and TO-202 epoxy packages.

pdficon Thyristor Miscellaneous Design Tips and Facts Application Note

This application note presents design tips and facts on the following topics: -Relationship of IAV IRMS and IPK -dv/dt Definitions -Examples of gate terminations -Curves for Average Current at Various Conduction Angles -Double-exponential Impulse Waveform -Failure Modes of Thyristor -Characteristics Formulas for Phase Control

pdficon AN1006 Testing Teccor Semiconductor Devices Using Curve Tracers

One of the most useful and versatile instruments for testing semiconductor devices is the curve tracer (CT). Although widely used by semiconductor

pdficon Surface Mount Soldering Recommendations Application Note

The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability. This application note discusses the different soldering methods for Littelfuse's Teccor brand thyristor products.

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