We offer expedited turn-key analytical services for evaluation of semiconductor components and packaging.
Services include:
- Scanning electron microscopy
- Qualitative X-ray microanalysis
- Real-time X-ray
- Packaging and die level cross-sectioning
- Chemical decapsulation
- Wet and dry chemical vertical de-layering
- Liquid crystal hotspot detection
To provide these services, we use state-of-the-art equipment from established companies such as JEOL, Nicolet Imaging Systems, IMI Integrated, B&G, and Royce Instruments.
For more information about how our semiconductor analytical services can help you, please complete this form: